Monday, September 9, 2013

Android World Update # Qualcomm’s new ET technology to help Samsung Galaxy Note 3 phone home with less power, heat

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Qualcomm's new ET technology to help Samsung Galaxy Note 3 phone home with less power, heat
Sep 9th 2013, 00:21, by Jeff Causey

qualcomm_qfe1100_et_chip

Whenever a manufacturer like Samsung introduces the latest iteration of a flagship device, the question always comes up as to whether owners of the current device should bother upgrading. Often the answer to this question may hinge not on whether faster hardware or bigger hardware is included in the new device, but whether something completely new is only available in the new device. Which brings us to the latest info we have discovered about the new Samsung Galaxy Note 3 – the inclusion of Qualcomm’s new envelope tracking technology. This new tech will appear for the first time in the Galaxy Note 3, but it will likely become the norm for at least high end devices thanks to the energy and heat savings it offers.

The ET technology is a new method Qualcomm has developed to manage signal variation and amplification on 4G LTE radio bands. As Qualcomm explains, LTE is made up of several hundred radio signals laid on top of each other at current bandwidths, with the potential for thousands of signals to be used in the future. As these signals are laid on top of each other, variation occurs depending on how many times the peaks align themselves. Typically, this variation was addressed by pumping up voltage to a fixed level to ensure an acceptable signal strength is maintained. The cost of this strategy is additional energy being used when it is not needed and additional heat being generated.

Qualcomm’s new ET technology is delivered via a dedicated chipset, the QFE1100, that constantly monitors and adjusts the amplification of the signal based on the output signal level. According to Qualcomm, this will result in a 20% improvement in power efficiency and a 30% improvement in heat dissipation. Besides helping batteries last longer, this also means manufacturers can continue their efforts to slim down devices thanks to a reduction in heat-absorbing material that is needed. Qualcomm also thinks manufacturers will be able to build devices capable of handling more bands, promoting more international devices at lower costs.

source: Qualcomm


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